SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

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United States of America Patent

APP PUB NO 20150020852A1
SERIAL NO

14332909

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus comprises: an air flow generator which generates a down flow by gas flowing from top to bottom around a substrate W held horizontally; a liquid film former which forms a liquid film by supplying a liquid on an upper surface of the substrate; a cooling gas discharge nozzle which discharges cooling gas of a temperature lower than a freezing point of the liquid to the liquid film and thereby freezes the liquid film; and a remover which removes a frozen film formed by freezing the liquid film from the substrate. The air flow generator reduces a flow velocity of the down flow when the cooling gas is discharged to the liquid film from the cooling gas discharge nozzle than when the liquid is supplied to the substrate from the liquid film former.

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Patent Owner(s)

Patent OwnerAddress
SCREEN HOLDINGS CO LTDKYOTO JAPAN KYOTO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IMURO, Yoshiki Kyoto, JP 1 10
KATO, Masahiko Kyoto, JP 189 2289
MIYA, Katsuhiko Kyoto, JP 59 827
YASHIKI, Hiroyuki Kyoto, JP 11 100

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