PEELING APPARATUS AND PEELING METHOD
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United States of America Patent
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N/A
Issued Date -
Jan 22, 2015
app pub date -
Jul 16, 2014
filing date -
Jul 18, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A peeling apparatus for peeling a device substrate from a stacked workpiece obtained by attaching the device substrate through a thermoplastic adhesive to a support substrate. The peeling apparatus includes a first surface plate having a first holding surface for holding the entire surface of the support substrate under suction and a first heating member for heating the first holding surface, a second surface plate having a second holding surface for holding the entire surface of the device substrate under suction and a second heating member for heating the second holding surface, and a moving unit for relatively moving the first surface plate and the second surface plate so that the first holding surface and the second holding surface are relatively moved away from each other in a direction perpendicular to the first holding surface and the second holding surface.
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