SEMICONDUCTOR DEVICE WITH PLATED CONDUCTIVE PILLAR COUPLING
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United States of America Patent
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Issued Date -
Jan 22, 2015
app pub date -
Oct 25, 2013
filing date -
Jul 16, 2013
priority date (Note) -
Abandoned
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Abstract
A semiconductor device with plated conductive pillar coupling is disclosed and may include a semiconductor die comprising a conductive pillar formed on a bond pad on the die, a substrate comprising an insulating layer with conductive patterns formed on a first surface of the substrate and a second surface opposite to the first surface, and a plating layer electrically coupling the conductive pillar and the bond pad on the first surface of the die to the conductive pattern on the first surface of the substrate. The conductive pillar, the conductive patterns, and the plating layer may comprise copper. The plating layer may fill a void between the copper pillar and the conductive pattern on the first surface of the substrate. The substrate may comprise a rigid circuit board, a flexible circuit board, a ceramic substrate, a semiconductor die, or semiconductor wafer.
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