ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME
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United States of America Patent
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app pub date -
Oct 10, 2014
filing date -
May 18, 2012
priority date (Note) -
Abandoned
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Abstract
A method of manufacturing an electronic component includes bonding a dome-shaped cap having a recess to a substrate on which are disposed a vibrator and a bonding material projecting in a rounded shape and surrounding the vibrator while the cap is disposed so that an open side of the recess faces the substrate and is relatively pressed to the substrate side. The bonding material is disposed so that, relative to the vibrator, an outer side end portion of the cap is located on the inner side of the bonding material or an inner side end portion of the cap is located on the outer side of the bonding material.
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