Method and apparatus for LDPC transmission over a channel bonded link

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United States of America Patent

PATENT NO 9184872
SERIAL NO

14510971

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Abstract

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A particular overall architecture for transmission over a bonded channel system consisting of two interconnected MoCA (Multimedia over Coax Alliance) 2.0 SoCs (Systems on a Chip) and a method and apparatus for the case of a “bonded” channel network. With a bonded channel network, the data is divided into two segments, the first of which is transported over a primary channel and the second of which is transported over a secondary channel.

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Patent Owner(s)

Patent OwnerAddress
ENTROPIC COMMUNICATIONS LLC1345 AVENUE OF THE AMERICAS 46TH FLOOR NEW YORK NY 10105

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barr, David San Jose, US 60 332
Chen, Na San Diego, US 68 187
Mueller, Arndt San Diego, US 21 120
Tsatsanis, Michail Huntington Beach, US 59 800

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