Importance

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Abstract

To provide a multilayer wiring substrate which can reliably prevent removal of a via conductor and which exhibits excellent connection reliability. A multilayer wiring substrate 10 has a multilayer build-up structure in which a plurality of resin insulation layers 33 and a plurality of conductor layers 42 are alternately stacked. Each of the resin insulation layers 33 formed of a resin insulation material 50 contains therein a glass cloth 51. The resin insulation material 50 of the resin insulation layer 33 has a via hole 43, and the glass cloth 51 has an aperture 52 at a position corresponding to the via hole 43. A portion of the glass cloth 51 corresponding to a opening edge of the aperture 52 protrudes inwardly from the inner wall of the via hole 43, and enters a side portion of the via conductor 44. Tip ends of glass fiber filaments 57 protruding from the inner wall 54 of the via hole 43 are bonded together through melting to form a weld portion 58.

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First Claim