METHOD OF MANUFACTURING WIRING BOARD
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United States of America Patent
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Issued Date -
Jan 29, 2015
app pub date -
Jul 25, 2014
filing date -
Jul 29, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A manufacturing method includes a step of forming a first plating mask on a base metal layer, a step of forming a main conductor layer on the base metal layer exposed from the first plating mask, a step of forming a second plating mask on them, a step of attaching a metal plating layer to an upper surface of the main conductor layer exposed from the second plating mask, a step of removing the first and second plating masks, a step of etching away a portion of the base metal layer to which the main conductor layer is not attached, and a step of forming a solder resist layer.
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