Light source having liquid encapsulant
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United States of America Patent
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Mar 17, 2015
Grant Date -
Jan 29, 2015
app pub date -
Jul 26, 2013
filing date -
Jul 26, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
In one embodiment, a light source comprising a substrate, a die, a liquid encapsulant, an attachment member and a resilient cover configured to hold the liquid encapsulant is disclosed. At least a portion of the resilient cover is easily stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion. One other embodiment discloses a light-emitting device comprising a die, a liquid encapsulant and the resilient cover. The resilient cover may comprise a dome shaped portion, a vertical portion and a thermal joint portion. In another embodiment, a lighting apparatus having similar resilient cover is disclosed. The resilient cover may further comprise a thermal joint portion having first and second indentations for absorbing thermal expansion.
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