SOUND INSULATION MATERIAL
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 5, 2015
app pub date -
Jul 3, 2013
filing date -
Jul 4, 2012
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
The performance of a sound insulation material in which chips are utilized is improved. The sound insulation material includes a chip layer containing many chips. The chip layer is covered with a coat, and the chip layer includes an unbreathable intermediate membrane layer dividing the chip layer into a plurality of layers.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully