CURVATURE COMPENSATED SUBSTRATE AND METHOD OF FORMING SAME

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United States of America Patent

APP PUB NO 20150035123A1
SERIAL NO

13956906

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A curvature-control-material (CCM) is formed on one side of a substrate prior to forming a Group III nitride material on the other side of the substrate. The CCM possess a thermal expansion coefficient (TEC) that is lower than the TEC of the substrate and is stable at elevated growth temperatures required for formation of a Group III nitride material. In some embodiments, the deposition conditions of the CCM enable a flat-wafer condition for the Group III nitride material maximizing the emission wavelength uniformity of the Group III nitride material. Employment of the CCM also reduces the final structure bowing during cool down leading to reduced convex substrate curvatures. In some embodiments, the final structure curvature can further be engineered to be concave by proper selection of CCM properties, and via controlled selective etching of the CCM, this method enables the final structure to be flat.

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Patent Owner(s)

Patent OwnerAddress
GLOBALFOUNDRIES INCGRAND CAYMAN KY1-1104

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bayram, Can Ossining, US 31 174
Bedell, Stephen W Wappingers Falls, US 409 5550
Sadana, Devendra K Pleasantville, US 897 9950

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