Wafer debonding using mid-wavelength infrared radiation ablation

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United States of America Patent

PATENT NO 9636782
APP PUB NO 20150035554A1
SERIAL NO

14226966

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Abstract

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Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dang, Bing Chappaqua, US 159 1437
Knickerbocker, John U Yorktown Heights, US 263 3934
Tsang, Cornelia Kang-I Mohegan Lake, US 28 543

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