Overlay displacement amount measuring method, positional displacement amount measuring method and positional displacement amount measuring apparatus
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United States of America Patent
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May 31, 2016
Grant Date -
Feb 5, 2015
app pub date -
Nov 8, 2013
filing date -
Aug 1, 2013
priority date (Note) -
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Abstract
In an overlay displacement amount measuring method according to an embodiment, a temperature distribution of a substrate during a pattern forming process and a temperature distribution of the substrate during a measuring process for measuring a positional displacement amount between patterns on the substrate by an electron microscope are measured. An expansion/contraction amount of the substrate between two processes is calculated based upon the two temperature distributions, and the positional displacement amount is corrected based upon the expansion/contraction amount. An overlay displacement amount between the pattern and a pattern formed on a layer different from the pattern is measured by an optical measuring apparatus, and the overlay displacement amount is corrected based upon the corrected positional displacement amount.
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