CHIP CONNECTION STRUCTURE AND METHOD OF FORMING
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United States of America Patent
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Oct 9, 2014
filing date -
May 10, 2012
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Abstract
Chip connection structures and related methods of forming such structures are disclosed. In one case, an interconnect structure is disclosed, the structure including: a pillar connecting an integrated circuit chip and a substrate, the pillar including a barrier layer, a first copper layer over the barrier layer, and a first solder layer over the first copper layer.
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