PROCESS FOR THE PREPARATION OF PRINTED WIRING BOARD, LAMINATE, LAMINATE FILM AND NON-CURABLE RESIN COMPOSITION USED FOR THE PRINTED WIRING BOARD, AND PRINTED WIRING BOARD PREPARED BY THE PROCESS
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United States of America Patent
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N/A
Issued Date -
Feb 12, 2015
app pub date -
Aug 7, 2014
filing date -
Aug 9, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A process for the preparation of a printed wiring board that can prevent generation of crack and warpage is provided. A process for the preparation of a printed wiring board, comprising a step of forming a curable resin layer and a non-curable resin layer sequentially on a surface of a substrate; a step of forming depressions in the non-curable resin layer and the curable resin layer from the non-curable resin layer side; a step of applying a catalyst for plating to a surface of the non-curable resin layer and surfaces of the depressions; a step of removing the non-curable resin layer and the catalyst for plating provided on the surface of the non-curable resin layer; and a step of electroless plating the surfaces of the depressions.
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