PACKAGE SUBSTRATE AND CHIP PACKAGE USING THE SAME

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United States of America Patent

SERIAL NO

14523955

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Abstract

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A package substrate is disclosed. The package substrate includes a base layer and a dam structure or a dent structure on at least one side of the base layer. The base layer may be a CCL core, a molding compound, or an epoxy base.

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Patent Owner(s)

Patent OwnerAddress
NANYA TECHNOLOGY CORPHWA-YA TECHNOLOGY PARK 669 FUHSING 3 RD KUEISHAN TAO-YUAN HSIEN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Po-Chun Changhua County, TW 71 106
Pei, Han-Ning Taipei City, TW 5 7

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