Electronic chip component and board having the same mounted thereon
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 5, 2015
Grant Date -
Feb 12, 2015
app pub date -
Dec 20, 2013
filing date -
Aug 9, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic chip component includes a ceramic body; external electrodes formed on end portions of the ceramic body; an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes a first electrode pad formed on a surface thereof and having the external electrodes disposed thereon, a second electrode pad formed on an opposing surface thereof, and a connection electrode pad connecting the first electrode pad to the second electrode pad and formed on a lateral surface between the surface and the opposing surface of the interposer, the first electrode pad is divided into first and second electrode patterns disposed at ends of the interposer based on a space formed therebetween, a non-electrode margin portion is formed between ends of the first electrode pad and ends of the interposer, and the connection electrode pad is formed on the lateral surface of the interposer.
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