SOLDERING METHOD AND CORRESPONDING SOLDERING DEVICE
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United States of America Patent
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Issued Date -
Feb 12, 2015
app pub date -
Dec 21, 2012
filing date -
Feb 1, 2012
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to a soldering method and a corresponding soldering device for soldering a printed circuit board (2) to an electric component (8) using a solder (6, 7), said solder (6, 7) being melted by heat and then connecting the component (8) to the printed circuit board (2). The heat required to melt the solder (6, 7) is generated by electrically energizing the component (8), thereby generating an electric heat loss in the component (8), said heat loss being transferred from the component (8) to the solder (6, 7) and melting the solder (6, 7).
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