Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
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United States of America Patent
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Oct 20, 2015
Grant Date -
Feb 12, 2015
app pub date -
Oct 28, 2014
filing date -
Oct 31, 2012
priority date (Note) -
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Abstract
Structures and methods of making a flip chip package that employ polyimide pads of varying heights at a radial distance from a center of an integrated circuit (IC) chip for a flip chip package. The polyimide pads may be formed under electrical connectors, which connect the IC chip to a chip carrier of the flip chip package, so that electrical connectors formed on polyimide pads of greater height are disposed at a greater radial distance from the center of the IC chip, while electrical connectors formed on polyimide pads of a lesser height are disposed more proximately to the center of the IC chip. Electrical connectors of a greater relative height to the IC chip's surface may compensate for a gap, produced by heat-induced warpage during the making of the flip chip package, that separates the electrical connectors on the IC chip from flip chip attaches on the chip carrier.
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