Importance

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Abstract

Techniques disclosed herein include a method and apparatus for stripping resist from a substrate without using high concentrations of toxic chemicals and without needing frequent bath replacement. Techniques include using a chemistry that lifts-off the resist, without substantially dissolving the resist, coupled with mechanically breaking removed resist into small particles using mechanical agitation and high fluid flow. Resist particles can then be removed from the vicinity of the wafer by a high-flow circulation out of a processing tank. Circulating flow can then be filtered to remove the resist particles from the circulating fluid and reintroduced into the processing tank. A filtering system can also remove particles from filters either during circulation or with circulation stopped.

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First Claim