HEATING DEVICE STRUCTURE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 19, 2015
app pub date -
Aug 14, 2013
filing date -
Aug 14, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present relates to a heating device structure, which comprises a heat conducting member to mate with the heat dissipation fins of an electronic device. Thereby, during the packaging process of the electronic device, the effect of multi-point heating can be achieved by combining the heat conducting member and the fins. Accordingly, heating can be performed rapidly to reach the soldering temperature. Without the influence of the structure of heat dissipation fins, the heating process will not be performed at low efficiency.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully