Printed circuit board method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9526178
APP PUB NO 20150047892A1
SERIAL NO

14519677

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A printed circuit board (PCB) backdrilling method is disclosed, where a conductive layer is disposed between a surface of a PCB on an intended-for-backdrilling side of a plated through hole (PTH) and a target signal layer of the PCB, and the method includes: performing a first backdrilling on the PTH with a first preset depth starting from the surface of the PCB; controlling the backdrill bit to move along the drill hole formed in the first backdrilling toward the target signal layer; and when the backdrill bit is in contact with the conductive layer, completing a second backdrilling with a second preset depth starting from the conductive layer.

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Patent Owner(s)

  • HUAWEI TECHNOLOGIES CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gao, Feng Shenzhen, CN 397 4160
Huang, Mingli Shenzhen, CN 8 27
Yang, Yongxing Shenzhen, CN 5 12

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