SOLID-STATE IMAGING DEVICE
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United States of America Patent
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Issued Date -
Feb 19, 2015
app pub date -
Mar 6, 2014
filing date -
Aug 13, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
According to one embodiment, a solid-state imaging device includes a first light-receiving portion and a first light guide layer. The first light-receiving portion is formed in the surface of a semiconductor substrate. The first light guide layer is formed to correspond to a portion above the first light-receiving portion, and has an inverse tapered shape in which the width becomes larger from an upper surface a lower surface. The inverse tapered shape ranges from the upper surface the lower surface.
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