Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device

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United States of America Patent

PATENT NO 9803111
APP PUB NO 20150048495A1
SERIAL NO

14379961

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Abstract

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An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1):

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Patent Owner(s)

  • HITACHI CHEMICAL COMPANY, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Honda, Kazutaka Tsukuba, JP 37 150
Nagai, Akira Tsukuba, JP 153 1801
Satou, Makoto Yuki, JP 25 118

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