ETCHED SILICON STRUCTURES, METHOD OF FORMING ETCHED SILICON STRUCTURES AND USES THEREOF

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United States of America Patent

APP PUB NO 20150050556A1
SERIAL NO

14387284

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Abstract

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A method of etching silicon of a material comprising silicon, the method comprising the steps of partially covering a silicon surface of the material comprising silicon with an elemental metal and then carrying out a metal-assisted chemical etching of the silicon by exposing the partially covered silicon surface to an etching composition, wherein at least some of the elemental metal for the metal-assisted chemical etching is formed by either: (a) exposing the silicon surface to a composition comprising metal ions, wherein the elemental metal forms by reduction of the metal ions and wherein the composition comprising metal ions is substantially free of HF, or (b) depositing the elemental metal directly onto the silicon surface.

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Patent Owner(s)

Patent OwnerAddress
NEXEON LTDOXFORDSHIRE OXFORDSHIRE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Friend, Christopher Michael Abingdon, GB 18 304
Jiang, Yuxiong Abingdon, GB 5 134
Liu, Fengming Reading, GB 11 104
Speed, Jonathon Reading, GB 2 12

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