Flexible Circuit Electrode Array for Improved Layer Adhesion
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United States of America Patent
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Issued Date -
Feb 19, 2015
app pub date -
Oct 17, 2014
filing date -
Dec 3, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention is a flexible circuit electrode array for improved layer adhesions where the metal conductors overlap the polymer insulator. The steps to build the flexible circuit are as follows. Deposit a base polymer layer. Deposit a conductive trace over the base polymer layer. Deposit a top polymer layer over the trace and prepare a void in the top polymer layer smaller than the surface of the trace. Deposit an electrode on the trace through the void with a periphery larger than, and overlapping the void.
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