PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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N/A
Issued Date -
Feb 26, 2015
app pub date -
Aug 21, 2014
filing date -
Aug 21, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A printed circuit board (PCB) and a method for manufacturing the PCB are disclosed. A PCB includes a transparent insulating substrate, a conductive circuit layer 16, and a transparent cover layer. The conductive circuit layer is located between the transparent insulating substrate and the transparent cover layer. The conductive circuit layer includes a first Ni—W alloy pattern layer, a copper pattern layer, and a second Ni—W alloy pattern layer. The first Ni—W alloy pattern layer is adhered with the transparent adhesive layer. Bottom surfaces of the conductive pattern layer are coated by the first Ni—W alloy pattern layer. Top surfaces and side surfaces of conductive pattern layer are coated by the second Ni—W alloy pattern layer.
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