BOTTOM-UP FILL IN DAMASCENE FEATURES
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United States of America Patent
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Feb 26, 2015
app pub date -
Aug 26, 2013
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Aug 26, 2013
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The embodiments herein relate to methods and apparatus for filling features with copper by a bottom-up fill mechanism without the use of organic plating additives. In some cases, filling occurs directly on a semi-noble metal layer, without the deposition of a copper seed layer. In other cases, the filling occurs on a copper seed layer. Factors such as the polarization of electrolyte, the use of a complexing agent, electrolyte pH, electrolyte temperature, and the waveform used to deposit material may contribute to promoting the bottom-up fill.
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