Self-aligned airgap interconnect structures

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United States of America Patent

PATENT NO 9490202
APP PUB NO 20150054122A1
SERIAL NO

14505087

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Abstract

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Devices and methods for forming a self-aligned airgap interconnect structure includes etching a conductive layer to a substrate to form conductive structures with patterned gaps and filling the gaps with a sacrificial material. The sacrificial material is planarized to expose a top surface of the conductive layer. A permeable cap layer is deposited over the conductive structure and the sacrificial material, Self-aligned airgaps are formed by removing the sacrificial material through the permeable layer.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cabral, Cyril Mahopac, US 13 95
Fletcher, Benjamin L Elmsford, US 29 333
Lin, Qinghuang Yorktown Heights, US 151 2185

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