Method for Producing Wafer Lens
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United States of America Patent
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app pub date -
May 19, 2014
filing date -
Mar 19, 2008
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Abandoned
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Abstract
Disclosed is a method for producing a wafer lens wherein a glass substrate is provided with a lens part which is made of a first curable resin. A sub-master molding part having a plurality of negative molding surfaces corresponding to the optical surface shape of the lens part is formed from a master having a plurality of positive molding surfaces corresponding to the optical surface shape of the lens part by using a second curable resin; a sub-master is formed by backing the sub-master molding part with a sub-master substrate; and the lens part is formed by filling the space between the sub-master and the glass substrate with the first curable resin and curing the resin therein. In this connection, the first curable resin is composed of an epoxy resin. Consequently, the production cost can be reduced, and a high-precision wafer lens having small curing shrinkage can be produced.
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