On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures

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United States of America Patent

PATENT NO 9362606
APP PUB NO 20150054592A1
SERIAL NO

13974804

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Abstract

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A vertical three dimensional (3D) microstrip line structure for improved tunable characteristic impedance, methods of manufacturing the same and design structures are provided. More specifically, a method is provided that includes forming a first microstrip line structure within a back end of the line (BEOL) stack. The method further includes forming a second microstrip line structure separated from the BEOL stack by a predetermined horizontal distance.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION;UNIVERSITY OF SOUTH CAROLINA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dewitt, Barbara S Essex Junction, US 7 24
Mina, Essam South Burlington, US 23 117
Rahman, B M Farid West Columbia, US 5 15
Wang, Guoan Irmo, US 42 233

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