Fabricating multi-component electronic module with integral coolant-cooling
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United States of America Patent
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Feb 16, 2016
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app pub date -
Oct 30, 2014
filing date -
Mar 8, 2013
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Abstract
Methods for fabricating a coolant-cooled component assembly are provided, which include providing a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- INTERNATIONAL BUSINESS MACHINES CORPORATION
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Arvelo, Amilcar R | Poughkeepsie, US | 28 | 423 |
Campbell, Levi A | Poughkeepsie, US | 279 | 10498 |
Ellsworth,, Jr Michael J | Poughkeepsie, US | 251 | 7920 |
McKeever, Eric J | Poughkeepsie, US | 44 | 350 |
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11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 16, 2027 |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
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