Electronic device having a cover in which a penetration hole is provided and manufacturing method of electronic device
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United States of America Patent
Stats
-
Jun 6, 2017
Grant Date -
Mar 5, 2015
app pub date -
Sep 4, 2014
filing date -
Sep 5, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic device includes a substrate, a lid which is bonded to the substrate, and a functional element which is provided between the substrate and the lid, in which the lid includes a penetration hole which penetrates a portion between an inner surface and an outer surface, the penetration hole includes a first hole portion and a second hole portion, a flat area of the second hole portion is set to be smaller than a flat area of the first hole portion, at least a part of an inner wall surface of the second hole portion substantially forms a right angle with respect to a bottom surface of the first hole portion, and the penetration hole is sealed with a sealing member.
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