SPUTTERING SYSTEMS FOR LIQUID TARGET MATERIALS
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United States of America Patent
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Mar 5, 2015
app pub date -
Aug 10, 2012
filing date -
Aug 11, 2011
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Abstract
A sputtering system comprises a magnetron assembly for depositing liquid metal films on a substrate. The magnetron assembly comprises a horizontal planar magnetron with a liquid metal target, a cylindrical rotatable magnetron with a metal target and a set of one or more shields forming a chamber between the planar and the rotatable magnetron.
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