Adhesive film and sealing method for organic electronic device using same

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United States of America Patent

PATENT NO 9343697
APP PUB NO 20150060836A1
SERIAL NO

14528828

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Abstract

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Provided are an adhesive film, an organic electronic device (OED) encapsulation product using the same, and a method of encapsulating the organic electronic device, and more particularly, an adhesive film for encapsulating an organic electronic element including a first adhesive layer having a loss coefficient (tan δ) at 60 to 100° C. of 1 to 5, and a second adhesive layer formed on the first adhesive layer, and a method of encapsulating an organic electronic device using the same.

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Patent Owner(s)

  • LG CHEM, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bae, Kyung Yul Daejeon, KR 33 249
Chang, Suk Ky Daejeon, KR 89 862
Cho, Yoon Gyung Daejeon, KR 64 435
Lee, Seung Min Daejeon, KR 227 1004
Shim, Jung Sup Daejeon, KR 45 342
Yoo, Hyun Jee Daejeon, KR 77 474

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