Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

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United States of America Patent

PATENT NO 9559029
APP PUB NO 20150061124A1
SERIAL NO

14523556

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Abstract

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A semiconductor device has a protective layer formed over an active surface of a semiconductor wafer. The semiconductor die with pre-applied protective layer are moved from the semiconductor wafer and mounted on a carrier. The semiconductor die and contact pads on the carrier are encapsulated. The carrier is removed. A first insulating layer is formed over the pre-applied protective layer and contact pads. Vias are formed in the first insulating layer and pre-applied protective layer to expose interconnect sites on the semiconductor die. An interconnect structure is formed over the first insulating layer in electrical contact with the interconnect sites on the semiconductor die and contact pads. The interconnect structure has a redistribution layer formed on the first insulating layer, a second insulating layer formed on the redistribution layer, and an under bump metallization layer formed over the second dielectric in electrical contact with the redistribution layer.

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Patent Owner(s)

  • STATS CHIPPAC PTE. LTE.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chow, Seng Guan Singapore, SG 216 7140
Lin, Yaojian Singapore, SG 329 9767
Shim, Il Kwon Singapore, SG 235 6827

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