Implementing low temperature wafer test

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United States of America Patent

PATENT NO 9335367
APP PUB NO 20150061712A1
SERIAL NO

14010657

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Abstract

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A method and structure are provided for implementing low temperature wafer testing of a completed wafer. A coolant gel is applied to the completed wafer, the gel coated wafer is cooled and one or more electrical test probes are applied through the gel to electrical contacts of the cooled wafer, and testing is performed.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hebig, Travis R Rochester, US 52 220
Kuczynski, Joseph Rochester, US 573 2136
Nickel, Steven R Rochester, US 11 15

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