SEPARATING DEVICE AND SEPARATING METHOD
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United States of America Patent
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Issued Date -
Mar 5, 2015
app pub date -
Feb 28, 2014
filing date -
Aug 30, 2013
priority date (Note) -
Abandoned
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Abstract
A separating device separates a chip mounted on a substrate through a connecting material, from the substrate. The separating device includes a heating unit that heats the substrate at a temperature less than a melting point of the connecting material.
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