Power and performance sorting of microprocessors from first interconnect layer to wafer final test
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United States of America Patent
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Nov 12, 2019
Grant Date -
Mar 5, 2015
app pub date -
Sep 4, 2013
filing date -
Sep 4, 2013
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Abstract
A system, method and computer program product for sorting Integrated Circuits (chips), particularly microprocessor chips, and particularly that predicts chip performance or power for sorting purposes. The system and method described herein uses a combination of performance-predicting parameters that are measured early in the process, and applies a unique method to project where the part, e.g., microprocessor IC, will eventually be sorted. Sorting includes classifying the IC product to a subset of a family of products with the product satisfying certain performance characteristics or specifications, in the early stages of manufacturing, e.g., before the end product is fully fabricated.
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