ADHESIVE BONDING OF A SHOE SOLE
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United States of America Patent
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Issued Date -
Mar 12, 2015
app pub date -
Sep 6, 2013
filing date -
Sep 6, 2013
priority date (Note) -
Abandoned
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Abstract
Embodiments of the present invention provide a method for constructing a shoe sole. Specifically, among other things, embodiments of the present invention provide a method for constructing a shoe sole including adhering an outsole to a midsole. The outsole is formed from an outsole compound. The outsole compound includes an organic compound, a porous material, and an adhesion enhancer. The organic compound has a boiling point greater than 120° C. The porous material has a specific surface area greater than two square meters per gram. The organic compound is supported on the porous material. The adhesion enhancer eliminates the need for buffing the outsole when forming the outsole from the outsole compound.
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