SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND CORE BASE-MATERIAL FOR SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
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United States of America Patent
Stats
-
N/A
Issued Date -
Mar 12, 2015
app pub date -
Dec 11, 2013
filing date -
Sep 12, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A substrate with built-in electronic component includes an electronic component, a first wiring layer, a second wiring layer, a via, and a core base-material. The first wiring layer has a first wiring portion. The second wiring layer has a second wiring portion. The via is configured to electrically connect the first wiring portion and the second wiring portion. The core base-material has a metal layer, at least one first storage portion, and a second storage portion, the metal layer being disposed between the first wiring layer and the second wiring layer, the at least one first storage portion being formed in the metal layer, the at least one first storage portion storing the electronic component, the second storage portion being formed on an outside of the first storage portion integrally with the first storage portion, the second storage portion storing the via.
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