SUBSTRATE PLATING JIG AND PLATING DEVICE USING SAME
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United States of America Patent
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Issued Date -
Mar 12, 2015
app pub date -
Apr 20, 2012
filing date -
Apr 20, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A plating jig and a plating device used for plating treatment of a substrate. The plating jig includes a mechanism rotatably driving a substrate holder, and detachably mounted on a plating bath integrally with a support portion. The plating jig includes the support portion which is formed in an engageable manner with a side wall of the plating bath, and the substrate holder which is vertically rotatably mounted on the support portion. The plating jig further includes a rotary mechanism for the substrate holder. The plating device utilizes the plating jig.
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