WET ETCHING PATTERNING COMPOSITIONS AND METHODS
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United States of America Patent
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Issued Date -
Mar 12, 2015
app pub date -
Aug 7, 2014
filing date -
Sep 11, 2013
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Abandoned
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Abstract
A method comprising etching a film comprising electrically conductive structures according to a pattern using an aqueous etching solution to provide an etched region having a first conductivity and an unetched region having a second conductivity, the second conductivity being greater than the first conductivity, wherein the aqueous etching solution either comprises 25 to 65% by weight of phosphoric acid and 1 to 18% by weight of nitric acid, or the aqueous etching solution comprises 65 to 75% by weight of nitric acid.
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