SEMICONDUCTOR MANUFACTURING APPARATUS
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United States of America Patent
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Issued Date -
Mar 12, 2015
app pub date -
Feb 24, 2014
filing date -
Sep 9, 2013
priority date (Note) -
Abandoned
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Abstract
A semiconductor manufacturing apparatus includes: a collet which sucks a semiconductor chip having a main surface on which a bump is formed, and an actuator which transfers the sucked semiconductor chip onto a mounting substrate or another semiconductor chip by driving the collet. A recessed portion for avoiding a contact between the collet and the bump is formed on a suction surface of the collet which sucks the semiconductor chip.
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