SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20150069413A1
SERIAL NO

14201695

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Abstract

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According one embodiment, a semiconductor device includes: a first electrode; a second electrode; a first semiconductor layer of a first conductivity type provided between the first electrode and the second electrode, the first semiconductor layer including silicon carbide; a second semiconductor layer of the first conductivity type provided between the first semiconductor layer and the second electrode, the second semiconductor layer having a lower impurity concentration than the first semiconductor layer, and the second semiconductor layer including silicon carbide; a third semiconductor layer of a second conductivity type provided between the second semiconductor layer and the second electrode, and the third semiconductor layer including silicon carbide; and a plurality of insulating layers provided between the third semiconductor layer and the second electrode.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBA1-1 SHIBAURA 1-CHOME MINATO-KU TOKYO 105-0023

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Morizuka, Kohei Hyogo-ken, JP 8 26

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