Wafer to wafer alignment by LED/LSD devices
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United States of America Patent
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Aug 11, 2015
Grant Date -
Mar 12, 2015
app pub date -
Sep 12, 2013
filing date -
Sep 12, 2013
priority date (Note) -
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Abstract
A method for wafer alignment includes forming a first alignment circuit within a first semiconductor wafer; the first alignment circuit is configured to emit an optical signal. Next, the first alignment circuit is activated upon receiving a first activation signal from a wafer bonding tool then the optical signal is sent to a second alignment circuit in a second semiconductor wafer in overlapping relation to the first semiconductor wafer. The second alignment circuit transmits a second activation signal to the wafer bonding tool and consequently the wafer bonding tool initiates an alignment technique between the first and second semiconductor wafers. The alignment technique uses the first and second alignment circuits for optical alignment.
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