SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
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United States of America Patent
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Issued Date -
Mar 12, 2015
app pub date -
Mar 10, 2014
filing date -
Sep 12, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In one embodiment, a semiconductor device includes a lead frame including a chip mounting portion and a lead portion separated from the chip mounting portion and having the same thickness as the chip mounting portion, a level of an upper face of the chip mounting portion being same as a level of an upper face of the lead portion. The device further includes a semiconductor chip mounted on the upper face of the chip mounting portion and electrically connected to the lead portion. The device further includes a molding resin which collectively seals up the lead frame and the semiconductor chip. The device further includes a metal film covering parts of rear faces of the chip mounting portion and the lead portion.
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