HEAT DISSIPATION CONNECTOR AND METHOD OF MANUFACTURING SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME, AND SEMICONDUCTOR MANUFACTURING APPARATUS
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United States of America Patent
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Issued Date -
Mar 12, 2015
app pub date -
Mar 6, 2014
filing date -
Sep 6, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In one embodiment, a heat dissipation connector mounted on a semiconductor chip and sealed up with a molding resin along with the semiconductor chip and a lead frame includes a heat dissipation portion configured to have a block shape, and have an upper face exposed out of the molding resin. The connector further includes a connecting portion configured to extend from a first side face of the heat dissipation portion, and electrically connect an electrode arranged on the semiconductor chip to the lead frame. The heat dissipation portion and the connecting portion are integrally made of the same metal sheet.
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