Interposer package-on-package structure
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United States of America Patent
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Jun 30, 2015
Grant Date -
Mar 12, 2015
app pub date -
Sep 18, 2013
filing date -
Sep 11, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit (IC) package includes an IC die having a first surface and a second surface opposite of the first surface. The IC package includes first contact members coupled to the second surface of the IC die. The IC package includes a bottom substrate having a first surface and a second surface opposite of the first surface, where the first surface of the bottom substrate is coupled to the second surface of the IC die via the first contact members. The IC package includes an interposer substrate coupled to the first surface of the IC die via an adhesive material, where the adhesive material is disposed on at least a surface of the interposer substrate. The IC package includes second contact members coupled along a periphery of the interposer substrate, where the interposer substrate is coupled to the first surface of the bottom substrate via the second contact members.
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