INTEGRATED CIRCUIT DIE INSIDE A FLEXIBLE CIRCUIT SUBSTRATE FOR A HEARING ASSISTANCE DEVICE
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United States of America Patent
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Issued Date -
Mar 12, 2015
app pub date -
Sep 12, 2013
filing date -
Sep 12, 2013
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Abstract
Disclosed herein, among other things, are systems and methods for improved circuit design for hearing assistance devices. One aspect of the present subject matter includes a hearing assistance device configured to compensate for hearing losses of a user. The hearing assistance device includes a flexible circuit substrate and an integrated circuit die embedded within the flexible circuit substrate. The integrated circuit die includes a digital signal processor (DSP) die, in an embodiment. In various embodiments, the DSP die includes a DSP configured to provide processing for the hearing assistance device.
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