Cooling system for electronics

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United States of America Patent

PATENT NO 9513064
APP PUB NO 20150075000A1
SERIAL NO

14547831

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

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First Claim

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cox, Aaron R Tucson, US 72 671
Grady,, IV William J Long Island City, US 10 90
Matteson, Jason A Raleigh, US 55 854
Minyard, Jason E Phoenix, US 32 198

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